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Agilent filters integrate into GSM RF modules

Posted: 03 Mar 2004 ?? ?Print Version ?Bookmark and Share

Keywords:agilent technologies? filter? film bulk acoustic resonator filter? fbar filter? microcap packaging?

Agilent Technologies Inc. has announced it is shipping samples of what it claims as the industry's smallest filter to select manufacturers for integration into GSM RF front-end modules.

Because of the small size and high thermal performance of the film bulk acoustic resonators (FBARs), filters can be incorporated into front-end modules, including transceiver modules.

The FBAR filters use Agilent's Microcap bonded wafer chip-scale technology to create one of the industry's smallest RF filter. Bryan Ingram, VP and GM of the company's Wireless Semiconductor Division, said, "Our Microcap packaging technology delivers miniature chip-scale FBAR filters that provide low temperature coefficient, small footprint and thinness perfectly suited for module integration."

Presently, GSM transceiver and switch module manufacturers are attempting to reduce thickness from about 1.6 mm to about 1mm to 1.2mm. With a height of 0.3mm, the bumped FBAR Microcap filters enable this reduction. It features a temperature coefficient of -25ppm/C, and 60 percent temperature sensitivity of surface acoustic wave (SAW) filters.

The resulting thin, small, highly integrated modules accelerate time-to-market for handset manufacturers and enable additional handset features such as camera modules, GPS locators, and infrared and Bluetooth connectivity.

The Microcap chip-scale FBAR filters are shipping in prototype quantities to select module manufacturers, and are expected to ship in volume in third quarter 2004.

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