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Chipbond buys Ultratech packaging lithography tool

Posted: 10 Mar 2004 ?? ?Print Version ?Bookmark and Share

Keywords:chipbond technology? ultratech? saturn spectrum 3e? packaging lithography tool?

Taiwan foundry Chipbond Technology Corp. has purchased Ultratech Inc.'s Saturn Spectrum 3e advanced packaging lithography tool. Chipbond intends to use the Ultratech system to perform gold bumping on 6- and 8-inch wafers for a wide range of display-driver devices.

Ultratech claims the Saturn Spectrum 3e is capable of handling multiple wafer sizes (4- through 8-inch) with no hardware, software or photomask change requirements. It is capable of exposing fine pitch (<25?m) high-aspect ratio gold bumps.

"Our key stipulation for adopting an Ultratech gold bump lithography solution was that it needed to provide a cost-effective means to help us cope with the industry's rapidly tightening requirements for gold bump pitch," said Fei Jain Wu, president of Chipbond. "In the Saturn Spectrum 3e, Ultratech provides a solution that allows us to accommodate these increasingly stringent requirements, further strengthening our ability to help our display customers meet their time-to-market demands," Wu added.





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