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Qualcomm, TSMC partner on 90nm process technology

Posted: 12 Mar 2004 ?? ?Print Version ?Bookmark and Share

Keywords:qualcomm? taiwan semiconductor? mobile station modem chipset?

Qualcomm Inc. has collaborated with Taiwan Semiconductor Mfg Co. Ltd (TSMC) on 90nm low-power process technologies for its Mobile Station Modem (MSM) family of chipsets.

Production of Qualcomm's products using TSMC's Nexsys 90nm process for wireless begins with the MSM6xxx family. In addition, the MSM7xxx family will be targeted first to TSMC's 90nm process and will continue to evolve to more advanced process technologies.

According to TSMC, the Nexsys 90nm low-k technology for SoC design features a full 90nm design system, including a portfolio of silicon-proven IP and libraries and a complete design flow that responds specifically to nanometer design challenges.

"We continue to build on the established relationship between Qualcomm and TSMC to optimize process technologies for 3G CDMA," said Sanjay K. Jha, president of Qualcomm CDMA Technologies. "At Qualcomm, we're committed to leading the wireless industry, and TSMC's Nexsys 90nm process provides our customers with a path to greater integration and improved performance for their wireless products," Jha added.





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