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Intel, LG to cooperate on home networking R&D

Posted: 15 Mar 2004 ?? ?Print Version ?Bookmark and Share

Keywords:intel? lg electronics? home networking? wlan? mobile communication?

Intel Corp. has concluded an agreement with LG Electronics to initially collaborate on development of home networking technologies and later expand the alliance to WLANs and mobile communications devices.

A memorandum of understanding (MoU) was signed by Patrick Gelsinger, Intel's chief technology officer during a week-long tour of Asia, and LG Electronics President and CTO Paik Woo-hyun.

The companies said a formal contract will be signed late this year.

LG said as part of the agreement it is looking at participating in Intel's digital home network R&D activities to be conducted at its Korean affiliate.

Earlier this week, Gelsinger officially opened Intel's Korean R&D center in Seoul, an initiative the chip giant announced late last year. The center will focus on developing wireless communications and home networking technologies. It is expected to employ 20 researchers by the end of the year.

LG Electronics also said it would take part in standardizing global digital home network systems with member companies of the Digital Home Working Group (DHWG) and the Universal Plug-and-Play (UPnP) Working Group.

The DHWG already counts among members industry leaders such as Samsung, Fujitsu, Gateway, HP, Intel, IBM, Kenwood, Microsoft, Nokia, Philips, Sharp, and Sony.

- John Walko

CommsDesign.com

jwalko@cmp-europe.com





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