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Intersil expands production relationship with IBM

Posted: 23 Mar 2004 ?? ?Print Version ?Bookmark and Share

Keywords:intersil? ibm? bicmos wafer? analog?

Intersil Corp. has revealed plans to move all internal volume of its 0.6?m BiCMOS wafer processing to IBM's Burlington, Vermont manufacturing facility, as part of the foundry services agreement entered into between the two companies in September of last year. Intersil will focus its entire Palm Bay, Florida manufacturing capacity for standard analog products fabricated on greater than 1?m proprietary processes on its 4-inch and 6-inch wafer lines.

Currently, 0.6?m analog products are being produced using the same BiCMOS process at both Intersil's 6-inch fabrication facility and IBM's Burlington 8-inch fabrication facility. Intersil will concentrate its internally developed 0.6?m production exclusively at IBM and enhance, modify and add to its proprietary greater than 1?m processes in Palm Bay which produce a wide range of standard analog products.

On the other hand, IBM's fabrication facility is fully qualified for Intersil's proprietary 0.67?m process and is ramping several products in production volumes now. Over the next six to nine months, all such products will be manufactured at IBM, freeing capacity in Palm Bay to focus its internal production on standard analog products that are well suited to micron-and-above geometries.

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