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Fujitsu to manufacture Lattice's FPGA products

Posted: 26 Mar 2004 ?? ?Print Version ?Bookmark and Share

Keywords:lattice semiconductor? fujitsu? fpga?

Lattice Semiconductor Corp. has tapped Fujitsu Ltd as its foundry for new FPGA products to be fabricated on Fujitsu's 130-, 90-, and probably 65nm processes.

The partners said Tuesday (March 23, 2004) that Fujitsu will manufacturer Lattice's next-generation FPGAs on its 130- and the 90nm process lines. Lattice also said it will support Fujitsu's new 300mm fab construction by making an advance payment.

Lattice had been using such foundry partners as United Microelectronics Corp., Chartered Semiconductor and Seiko Epson in Japan. "After long evaluation, we believe that Fujitsu will probably provide the best technology, which is not available in open foundries," said Cyrus Y. Tsui, chairman and CEO of Lattice. Lattice said it intends to maintain existing foundry contracts for conventional products, but Fujitsu will produce Lattice's new products using 130nm and beyond technology.

Fujitsu said the contract follows an earlier deal with Transmeta as a strategic partnership. By sharing design resources with its partners, Fujitsu is seeking to establish a new business model based on its 300mm fab under construction in its Mie plant.

When process technology scales down, more resources and time are required to design a device. "It becomes difficult for one company to do everything. If we follow the conventional style of business, the business would not be profitable," said Ono.

Fujitsu plans to invest total ?160 billion (about $1.5 billion) on its new 300mm plant that will begin operation in April 2005. It will have a monthly capacity of 12,000 wafers a month at full operation.

Lattice will be one of the investors and will make an advance payment. "The advance payment is for a long-term, stable supply and for accessibility to Fujitsu's future technology. The detail will be nailed down within 90 days," said Tsui.

The two companies have developed 130nm embedded flash CMOS process technology using copper wiring and a low-k (<3.0) metal insulator.

Based on the joint work, Lattice also announced that it will introduce new FPGA families targeting the non-volatile, embedded and low-end segments of FPGA market.

FPGA products formed a $2.1 billion market in 2003, and will grow to a $5.1 billion scale in 2007, according to Lattice estimates. Tsui said nonvolatile, embedded and low cost segments will be the growth drivers for the FPGA market.

Lattice announced three product families: the next-generation of LatticeXP and LatticeSC families and a new LatticeEC family.

The LatticeXP is a family of nonvolatile, reconfigurable FPGAs incorporating embedded flash. It will employ jointly developed 130nm embedded flash CMOS process technology.

LatticeSC is a family of highest-density products to be fabricated using Fujitsu's 90nm process. It incorporates a programmable fabric supporting devices with over 10 million system gates, 10 million bits of embedded RAM and embedded system functions.

LatticeEC focuses on low-cost FPGAs based on Fujitsu's low-k, copper metallization 130nm process.

Sampling begins this summer, and Lattice plans to begin volume production of 130nm devices in the fall, with 90nm devices in the first quarter 2005.

Lattice is also in discussion with Fujitsu about manufacturing 65nm technology products. Fujitsu plans to begin fabrication of 65nm devices in the second half of 2006.

- Yoshiko Hara

EE Times

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