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Amkor, Casio join forces on wafer-level packaging

Posted: 26 Mar 2004 ?? ?Print Version ?Bookmark and Share

Keywords:amkor technology? casio computer? casio micronics? wafer-level semiconductor packages? wlp?

Amkor Technology Inc., Casio Computer Co. Ltd and Casio Micronics Co. Ltd have established business and technology licensing agreements for assembly and test of wafer-level semiconductor packages, commonly known as WLP.

As part of the collaboration, Amkor will undertake sales and marketing of this WLP product. Casio Micronics will provide wafer level processing and Amkor will conduct final test, singulation and inspection of the WLP devices. Amkor also has the option to enter into a technology license with Casio under which Amkor would have the ability to install and use Casio's WLP technology in Amkor's factories.

"This collaboration builds on our existing wafer-level packaging capability with the addition of Casio's outstanding WLP technology," said Bruce Freyman, Amkor's president and COO.

"Casio And Casio Micronics look forward to partnering with Amkor's production capability, packaging experience, and worldwide sales force. This agreement represents an important step in accelerating the standardization of WLP packaging and expanding its adoption by semiconductor suppliers and electric device manufacturers," said Yukio Kashio, Casio's EVP.





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