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RFMD PA module provides -51dBc linearity

Posted: 24 Mar 2004 ?? ?Print Version ?Bookmark and Share

Keywords:rf micro devices? rfmd? rf3163? cdma power amplifier module? pa module?

RF Micro Devices Inc. (RFMD) has announced that it has begun high volume production shipments of its RF3163 CDMA power amplifier (PA) module to a top-two CDMA handset OEM headquartered in Korea.

Based on the company's Lead Frame Module (LFM) packaging technology that reduces component count, product size and total cost, the RF3163 is a high-performance GaAs HBT CDMA power amplifier module in a 3-by-3-by-0.9mm package. It is designed for U.S. Cellular CDMA IS-95, 1xRTT and 1xEV-DO operation, and offers one of the best-in-class ruggedness, thermal dissipation, moisture sensitivity level, electrostatic discharge sensitivity. At 28dBm, the device provides an efficiency of 41 percent and linearity of -51dBc.

According to RFMD, the LFM packaging technology eliminates surface-mount devices and the associated costs of surface mount device placement by integrating the functionality of passive components into the GaAs die. Products designed using the LFM technology do not require laminate or LTCC substrates or surface-mount components.





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