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Agere devices reduce RF transistor packaging costs

Posted: 31 Mar 2004 ?? ?Print Version ?Bookmark and Share

Keywords:rf transistor? agere systems? rf overmolded plastic packaged transistor?

Promising to reduce the costs of RF transistor packaging by up to 25 percent, Agere Systems Inc. has announced five RF overmolded plastic packaged transistor products that will lower the overall costs and accelerate deployment of wireless basestation amplifier equipment.

"Wireless infrastructure equipment manufacturers are facing extreme pressure to reduce capital and operational costs," said Carlos Garcia, VP of Agere. "These demands drive the urgent need for such lower-priced RF power technology as plastic RF transistors. To build on our exciting momentum in the RF market, we are rolling out this new product family - squarely addressing what our customers need most."

Adhering to several wireless standards, the lead-free plastic-encased transistors are capable of continuous operation at a 200C junction temperature. The ICs that are being offered with overmolded plastic packaging are the AGRA10, AGR09030, AGR09045, AGR09060, and AGRB10. The first four devices can be used across frequencies ranging up to 1GHz, while the AGRB10 can be used in frequencies spanning 1GHz to 2.7GHz. The five LDMOS devices range in power from 10W to 60W.

Agere explains that ceramic has been the main substance used with RF transistors for several years and is a more expensive material than plastic.

The new line of transistors is sampling and will be available in production quantities by May 2004. The transistors range in price from $8.50 to $32 in quantities of 10,000.





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