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Amkor to assemble, test RF chips for Thine Electronics

Posted: 22 Apr 2004 ?? ?Print Version ?Bookmark and Share

Keywords:amkor technology? thine electronics? fabless semiconductor? rf chip? cellphone?

Amkor Technology Inc. is providing assembly and test services to Thine Electronics Inc., a rapidly growing fabless semiconductor company based in Tokyo, Japan.

Initially, Amkor will assemble and test Thine's latest RF chip for cellphone applications using Amkor's MicroLeadFrame package, which has been designed to meet Japan's QFN specifications. Amkor will perform the assembly and test at its J1 factory in Iwate, Japan, with volume production starting in the second quarter of 2004.

"Our partnership with Amkor gives us both domestic and regional assembly and test with enough production capacity of more than one million pieces per month, which is crucial to our corporate expansion goals," said Tetsuya Iizuka, president and CEO of Thine Electronics.

"Because the first product that Amkor is packaging for us is our introduction into the cellphone RF market, we want to keep assembly and test in a domestic location to ensure that we meet our customer's goals," Iizuka added.





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