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Cypress MicroSystems PSOCs come in MLF package

Posted: 03 May 2004 ?? ?Print Version ?Bookmark and Share

Keywords:cypress microsystems? cypress semiconductor? programmable system-on-chip? psoc? microleadframe?

Cypress MicroSystems Inc., a subsidiary of Cypress Semiconductor Corp., has introduced a number of the company's Programmable System-on-Chip (PSOC) mixed-signal array devices in the MicroLeadFrame (MLF) package.

According to Cypress MicroSystems, the small size and weight, along with excellent thermal and electrical performance, make the MLF package an ideal choice for handheld portable devices.

"PSoC gives designers the ultimate in flexibility," said Nathan John, director of marketing for Cypress MicroSystems. "The small size and superior thermal performance of the MLF package enables designers to use PSoC devices in the most demanding portable, space-sensitive applications. They can now add analog and digital functionality to their products while further reducing their size."

Utilizing flush leads, MLF packaging has a 50 percent smaller footprint and roughly half the parasitic lead inductance of conventional 4.4mm SSOP packages. The package offers ExposedPad technology as a thermal enhancement by having the die attach paddle exposed on the bottom of the package surface to provide an efficient heat path when soldered directly to the PWB. It also reduces package profile height by <1mm.

Available in 48-lead MLF packages, pricing in 10,000-unit quantities is $2.35 for the CY8C27xxx; $1.45 for the CY8C24xxx and $1.07 for the CY8C22xxx.

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