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ChipMOS to offer gold-bump services using Saturn tool

Posted: 07 May 2004 ?? ?Print Version ?Bookmark and Share

Keywords:chipmos technologies? saturn spectrum? 3e? packaging lithography tool? ultratech?

ChipMOS Technologies Ltd has purchased Saturn Spectrum 3e advanced packaging lithography tool from Ultratech Inc. With the addition of the Saturn Spectrum 3e tool, ChipMOS intends to commence gold-bumping services from its Taiwan facility to support its FPD driver device customers.

"The Saturn Spectrum 3e met our stringent gold bumping requirements by providing multi-generation tool extendibility, along with the ability to handle multiple wafer sizes (6- and 8-inch) with no hardware change requirements, thus reducing both equipment and tooling costs," said Ricky Liu, head of ChipMOS' wafer bumping business unit.

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