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Manufacturing/Packaging??

Unitive boosts chip performance with latest tech app

Posted: 26 May 2004 ?? ?Print Version ?Bookmark and Share

Keywords:unitive? ic? wlcsp? spun-on polymer coating?

Unitive Inc. has developed a novel process of applying a new spun-on polymer coating technology that permits further reductions in the size of ICs while improving performance and enables dramatic increases in WLCSP reliability.

A typical single-layer polyimide coating is often used today as a stress buffer for wire bond, flip-chip and ball load packaging solutions; however, the company has developed a process of stacking polyimide layers and integrates the material with thick-plated copper.

Market forces driving this technology innovation, for example, include wireless phones, PDAs and other portable devices that are able to perform increasingly complex functions. The electronic subsystems enabling this performance must be integrated with ever increasing functionality, perform with greater reliability and in the same or smaller space.

"The customer gets far more design flexibility for chip integration," said Dan Mis, Unitive's VP of technology integration. "This new polyimide technology application allows chip designers to integrate more technology at the wafer level, on a smaller footprint and with exceptional performance and reliability," he added.





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