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UMC claims 90nm leadership over TSMC

Posted: 27 May 2004 ?? ?Print Version ?Bookmark and Share

Keywords:united microelectronics? tsmc? xilinx? 90nm? wafer?

Taiwanese foundry United Microelectronics Corp. is claiming to the lead over rival foundry Taiwan Semiconductor Mfg Co. Ltd with the deployment of its 90nm manufacturing process on May 24, 2004.

UMC first announced working customer silicon at 90nm in March 2003, and subsequently announced volume production by Xilinx Inc. and Texas Instruments Inc.

UMC claimed the speed of its 90nm ramp-to-volume production puts it ahead of its competitors in the foundry industry.

"Process technology leadership requires a huge commitment in terms of research and development resources. UMC has consistently made that commitment because it is an important part of our fundamental strategy of maximizing the competitiveness of our customer's products," said Jackson Hu, UMC's CEO.

UMC said it expects to expand 90nm production on 300mm wafers at its Fab 12A facility in Taiwan. The move is based on current customer requests, and will bring the process technology to volume production at UMCi, the 300mm foundry subsidiary in Singapore.

- Peter Clarke

EE Times





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