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Manufacturing/Packaging??

Newport system offer "advanced alignment"

Posted: 02 Jun 2004 ?? ?Print Version ?Bookmark and Share

Keywords:newport? mrsi-605? advanced packaging die bonder?

Newport Corp. has added an "advanced alignment" feature to its MRSI-605 packaging die bonder, enabling components to be placed with 10?m accuracy relative to features or fiducials in both x and y axes.

According to Newport, this improvement in placement accuracy, achieved through enhancements in lighting, software and vision, delivers the capabilities required for ultra precision assembly.

The MRSI-605 AP is targeted at end users in the semiconductor and electronic packaging markets, including manufacturers of MEMS, advanced semiconductor packages, multichip modules, military and defense hybrids, microwave and RF circuits and photonics packages.

The system operates with ICON-based Windows software, which provides functionality and flexibility. New vision tools such as an adjustable region of interest, enhanced gain control and filters and 360 pattern matching enable vision processing of challenging substrate and die materials.

The system's "feather touch" force control, combined with closed loop force feedback provides the ability to handle delicate devices without damage to internal features, such as GaAs and InP devices. Material presentation methods include waffle pack, Gel-Pak and wafer.

More information on the company's available semiconductor equipment is available on their website.





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