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TI Asia chief highlights commitment for wireless devices

Posted: 07 Jun 2004 ?? ?Print Version ?Bookmark and Share

Keywords:texas instruments? wireless 2.5g? 3g mobile devices?

In a keynote address delivered at IAFA 2004 Computex, Texas Instruments Inc. Asia Ltd President Terry Cheng revealed the company's plans for the wireless 2.5G and 3G mobile devices in Asia.

"TI believes Asia is experiencing significant global wireless trends, including the need for seamless mobility and connectivity and immediate access to multiple forms of voice and data," said Cheng. "As demand grows for applications and market size, we will see ever-increasing amounts of innovation devoted to the wireless platform. To help our local customers succeed in this dynamic environment, TI has become an innovation engine and has increased its application support for customers, including Taipei and Shanghai wireless support design centers committed to developing 3G multimedia terminal solutions for the Asia market," he added.

Through its involvement in COMMIT, a R&D joint venture with Chinese handset manufacturers, TI is enabling next-generation chipset solutions for the China market. Also important for driving 3G growth in China, the company expects to deliver the first TD-SCDMA chipset before the end of 2004.

TI delivers complete chipsets for all major cellular standards, including GSM, GPRS, EDGE and UMTS which includes WCDMA, cdma2000 1X and cdma2000 1xEV-DV.

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