Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > RF/Microwave

Siemens selects ADI, TTPCom wireless technologies

Posted: 22 Jun 2004 ?? ?Print Version ?Bookmark and Share

Keywords:edge? gsm? wireless? blackfin softfone? smartphones?

Siemens Information and Communications Wireless Modules (Siemens ICM WM), Analog Devices Inc. (ADI) and TTPCom Ltd announced that they are developing a range of products based on ADI's and TTPCom's EDGE for GSM evolution technologies.

With the collaboration, Siemens ICM WM's new EDGE-capable modules are expected to offer data-intensive 3G-type services including video downloads and high-speed Internet access.

Siemens ICM WM, ADI, and TTPCom have a longstanding relationship that began in November 2000. This collaboration has progressed through successive generations of wireless technology, from GSM, through GPRS, and now to EDGE.

The first Siemens EDGE module is powered by ADI's Blackfin SoftFone for EDGE chipset and TTPCom's EDGE protocol software. Equipped with quad band GSM, the MC75 can be used in all GSM networks worldwide and has a USB port for plug and play functions. The compact MC75 is especially suitable for smartphones, PDAs and other mobile computing applications. It will go into mass production in the first quarter of 2005.

Article Comments - Siemens selects ADI, TTPCom wireless...
*? You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top