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Sanmina-SCI, Agilent develop new x-ray technique for PCBAs

Posted: 06 Jul 2004 ?? ?Print Version ?Bookmark and Share

Keywords:multilayer backplane? printed circuit board assemblies? 5dx series 5000? automated x-ray system?

Agilent Technologies Inc. and Sanmina-SCI Corp. have revealed a new technique for rapidly generating high-resolution, sub-surface 3D scans of complex multilayer backplane and printed circuit board assemblies (PCBAs).

Using Agilent's 5DX Series 5000 Automated X-ray System, the new method verifies how well press-fit connectors with compliant pins are positioned within plated-through-hole (PTH) conduits. The sub-surface 5DX application provides efficiencies not previously achievable.

According to Sanmina-SCI, the new 5DX sub-surface scan application has clearly proved to verify press-fit connector contact integrity far more quickly and thoroughly than what is currently possible with conventional assembly inspection and test methods in production environments. The company noted that when multiple component types, including surface-mount devices, populate a backplane or PCBA, the new inspection method can scan the entire backplane - both surface and sub-surface simultaneously - to check solder contacts of components as well as press-fit connector contact integrity.





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