Tessera, NEC sign technology licensing deal

Tessera Technologies Inc. has signed a new technology licensing agreement with NEC Electronics Corp.

As part of the agreement, the license technology will be used by both NEC Electronics and its subcontractors. The technology available to NEC Electronics covers a broad range of chip-scale and multichip package types, including IC devices packaged in "face-down," "face-up," "fold-over," "stacked," and "system-in-package" (SiP) formats, utilizing many different types of materials, including packages using either tape and laminate substrates. NEC Electronics will utilize Tessera's technology in a broad range of semiconductor devices, including ASICs, application specific standard products (ASSPs) and logic devices. These semiconductors are integrated into a variety of products, such as wireless communications devices, consumer products, and computing electronics.