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TI, DoCoMo to codevelop 3G handset chips

Posted: 15 Jul 2004 ?? ?Print Version ?Bookmark and Share

Keywords:ntt docomo? umts? w-cdma? gsm? gprs?

Texas Instruments Inc. (TI) and NTT DoCoMo Inc. will jointly develop a cost-competitive, multimode UMTS (W-CDMA/GSM/GPRS) chipset to serve the worldwide 3G handset market. This collaboration further strengthens the relationship between the two companies to drive the faster market adoption of 3G handsets.

An integrated UMTS digital baseband and applications processor will be developed based on TI's OMAP2 architecture and NTT DoCoMo's W-CDMA technology for NTT DoCoMo handsets and other 3G handsets worldwide. Additionally, the agreement will include development and testing of power management, RF and protocol software that will be made available as system solutions to TI's worldwide customer base.

Expanding upon TI's existing UMTS chipset portfolio, TI will also develop a series of UMTS chipsets for the general market based on this solution with a roadmap encompassing multimode EDGE and higher data rate HSDPA offerings. The complete system solution will include the integrated digital baseband and OMAP 2 applications processor, as well as RF and power management devices.





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