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Novellus enhances chemical vapor deposition platform

Posted: 19 Jul 2004 ?? ?Print Version ?Bookmark and Share

Keywords:novellus systems? chemical vapor deposition? cvd? speed platform? speed next?

Novellus Systems Inc. disclosed that it has made a significant enhancement to its chemical vapor deposition (CVD) SPEED platform.

The new SPEED NExT is the result of a joint development effort between Novellus and a Korean DRAM manufacturer, and is designed to provide the industry with a high-density plasma (HDP) gap fill technology for volume production at the 65nm node.

To address the challenges of high aspect ratio gap fill at the 65nm node, SPEED NExT builds upon the high conductance chamber design of the existing SPEED platform with an innovative source technology that enables repeatable gap fill across a 300mm wafer. In addition, the ability to control the wafer position relative to the source allows the platform to have a wider gap fill process window.

According to the company, these gap fill improvements are not made at the expense of throughput or particle performance. It also added that innovation in the clean technology resulted in a differentiated ability to significantly increase the batch size between plasma cleans, thereby reducing clean time per wafer.

Dr. Michael S. Barnes, VP and GM of Novellus' HDP Business Unit, said, "We are encouraged by the customer results we're seeing with the SPEED NExT system. We have designed this capability to allow our customers to successfully migrate their existing SPEED system to the 65nm node."

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