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NanoStar & NanoFree 300?m solder bump wafer chip-scale package application

Posted: 16 Jun 2004 ?? ?Print Version ?Bookmark and Share

Keywords:nanostar? nanofree? csp? chip scale package?

This app note provides the necessary design and reliability information to apply the NanoStar 300?m solder bump packages.

View the PDF document for more information.

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