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Manufacturing/Packaging??

Amkor to take hold of Unitive

Posted: 26 Jul 2004 ?? ?Print Version ?Bookmark and Share

Keywords:unitive? unitive semiconductor? wafer bumping? wafer-level packaging? electroplated?

Amkor Technology Inc. has signed definitive agreements to acquire privately-held Unitive Inc., based in North Carolina (Unitive), and to obtain a majority interest of about 60 percent in Taiwan-based Unitive Semiconductor Taiwan Corp. (UST), a joint venture between Unitive and various Taiwanese investors. Unitive and UST are providers of wafer-level technologies and services for flip-chip and wafer-level packaging applications.

With these acquisitions, Amkor gains technology for electroplated wafer-bumping and turnkey wafer-level chip-scale packaging, together with installed high-volume 200mm and 300mm electroplated wafer-bumping and wafer-level packaging manufacturing operations. Unitive is on the forefront of development in "back-end" wafer-level processing technologies including wafer-level CSP, electroplated lead-free and low alpha wafer bumping, fine pitch solder bumps, redistribution, and multi-layer thin film capabilities.

The current Unitive and UST management teams in North Carolina and Taiwan will remain in place. The Unitive organization in North Carolina will continue to focus on development of advanced bumping and wafer-level packaging technologies, which will be integrated into Amkor's turnkey assembly and test solutions. Through the Unitive facilities in North Carolina, Amkor will offer wafer bumping, wafer-level packaging and other back-end wafer level processing. In Taiwan, UST will provide electroplated wafer-bumping and, through integration with Amkor's operations, a complete suite of wafer-level processing, assembly and test services.





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