Amkor completes acquisition of Unitive

Amkor Technology Inc. has completed the acquisition of Unitive Inc. together with a majority interest in Unitive Semiconductor Taiwan Corp. (UST) for $48 million. Amkor acquired about 60 percent of UST and about 93 percent of Unitive, the remaining 7 percent of Unitive to be acquired in a subsequent restructuring. Unitive and UST will operate as subsidiaries of Amkor.

With these acquisitions, Amkor gains technology for electroplated wafer bumping and turnkey wafer level chip scale packaging, together with installed and operationally qualified, high volume 200mm and 300mm electroplated wafer bumping and wafer level packaging manufacturing operations.

The current Unitive and UST management teams in North Carolina and Taiwan will remain in place. Unitive will continue to focus on development of advanced wafer level processing technologies and will offer turnkey wafer bumping and wafer level packaging services. UST will provide electroplated wafer bumping and, through integration with Amkor's operations, a complete suite of wafer level processing, assembly and test services.