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Philips MOSFETs have enhanced thermal performance

Posted: 02 Sep 2004 ?? ?Print Version ?Bookmark and Share

Keywords:royal philips electronics? high performance automotive trenchmos mosfet? hpa trenchmos mosfet? lfpak? buk9y19-55b?

Royal Philips Electronics disclosed the availability of its High Performance Automotive (HPA) TrenchMOS MOSFETs in its loss-free packaging (LFPAK). Combining its experience in automotive and TrenchMOS technology, the company developed these devices to meet the specific requirements of the automotive industry.

The LFPAK blends the small-size advantages of the SO8 package with the superior thermal properties of much larger packages such as DPAK. According to Philips, this enables design engineers to improve the performance of applications and conserve board space. The enhanced thermal characteristics offer faster switching and allow heat to be dissipated easily while maintaining the lowest possible operating temperature. The LFPAK also conducts a significant amount of power upwards and out through the source lead, giving it thermal resistances lower than SO8, and comparable with much larger packages such as DPAK and D?PAK.

The BUK9Y19-55B, BUK9Y40-55B and BUK9Y30-75B devices operate at logic level and are rated at 175C. Target applications include engine management systems and automotive motor drives.

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