Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
?
EE Times-Asia > RF/Microwave
?
?
RF/Microwave??

Epcos PaiD module measures 8-by-5-by-1.5mm

Posted: 31 Aug 2004 ?? ?Print Version ?Bookmark and Share

Keywords:epcos? cdma 850? paid module? power amplifier with integrated duplexer module?

Epcos announced that it has set another milestone in miniaturization of passive electronic components for the CDMA 850 mobile radio standard with the release of its PaiD (power amplifier with integrated duplexer) module, which measures 8-by-5-by-1.5mm.

Conventional solutions for CDMA 850 mobile handsets are based on discrete designs that require power amplifier modules (PAs), SAW duplexers, SAW filters and coupling capacitors, the company explained.

Aside from saving board space, customers benefit from high cost efficiency combined with improved electrical properties. Because of the combination of InGaP HBT PAs featuring outstanding temperature stability with SAW duplexers and filters from Epcos, the LTCC module has good electrical properties and makes longer talk times possible.

From mid-2005, the PaiD modules will be offered for the PCS band as well.





Article Comments - Epcos PaiD module measures 8-by-5-by...
Comments:??
*? You can enter [0] more charecters.
*Verify code:
?
?
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

?
?
Back to Top