Epcos PaiD module measures 8-by-5-by-1.5mm

Epcos announced that it has set another milestone in miniaturization of passive electronic components for the CDMA 850 mobile radio standard with the release of its PaiD (power amplifier with integrated duplexer) module, which measures 8-by-5-by-1.5mm.

Conventional solutions for CDMA 850 mobile handsets are based on discrete designs that require power amplifier modules (PAs), SAW duplexers, SAW filters and coupling capacitors, the company explained.

Aside from saving board space, customers benefit from high cost efficiency combined with improved electrical properties. Because of the combination of InGaP HBT PAs featuring outstanding temperature stability with SAW duplexers and filters from Epcos, the LTCC module has good electrical properties and makes longer talk times possible.

From mid-2005, the PaiD modules will be offered for the PCS band as well.