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Chip makers proposes standard for networking automotive

Posted: 15 Sep 2004 ?? ?Print Version ?Bookmark and Share

Keywords:analog devices? philips? networking automotive? safe-by-wire?

Analog Devices Inc., Autoliv Inc., Delphi Corp., Key Safety Systems, Philips, Special Devices Inc., TRW Automotive, as well as Bosch, Siemens VDO Automotive and Continental Temic (BST) have established the Safe-by-Wire Plus consortium to combine their experience and knowledge in defining a global standard for networking automotive occupant safety systems for the benefit of automotive manufacturers and consumers.

The goal of the consortium is to combine what have been two independent and competing automotive safety bus standards, one developed by the Safe-by-Wire consortium and the other by the BST group into a single global standard that captures the best features from each implementation. Through component standardization, the Safe-by-Wire Plus consortium expects to help reduce development costs and extend the benefits of economies of scale to automotive manufacturers, thus allowing more efficient integration of advanced safety features.

The Safe-by-Wire Plus consortium is planning to release version 2.0 of the Automotive Safety Restraints Bus specification (ASRB 2.0) this month. It will be based on the existing Safe-by-Wire ASRB 1.0 specification while incorporating some of the concepts from the work that has been conducted by BST. The ASRB 2.0 specification will maintain full compatibility with the existing Safe-By-Wire physical layer to preserve compatibility with Safe-By-Wire (ASRB 1.0) systems and components in development today. The consortium also plans to submit the ASRB 2.0 specification to the appropriate ISO working group for consideration as a global standard later this year.





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