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Molex acquires packaging supplier INCEP Technologies

Posted: 21 Sep 2004 ?? ?Print Version ?Bookmark and Share

Keywords:molex? incep technologies? interconnect? semiconductor?

Interconnection components supplier Molex Inc. has acquired INCEP Technologies Inc., in an attempt to penetrate the market for power delivery interconnect solutions.

Financial terms of the transaction were not disclosed.

Founded in 1998, INCEP Technologies provides system-level approaches to power delivery, high-density packaging, and thermal management solutions. Molex and INCEP have for the past two years engaged in a joint partnership developing advanced power delivery solutions for high-performance semiconductors.

"There is a large opportunity to service the market's growing need for complete power delivery solutions from the source to the destination," said Joe King, vice chairman and chief executive of Molex, in a statement. "This acquisition gives us an excellent opportunity to strengthen our growing position in power delivery," King added.

Molex has made selective acquisitions over the years, such as Beau Interconnect and Schott Optovance, but has generally relied on an organic growth strategy.

By acquiring INCEP, Molex gains access to the company's patented packaging technology that uses a high efficiency interconnection system to deliver power to the device substrate surface from a voltage regulator mounted over the device.

INCEP's technology allows the use of a single heat dissipating device and retention solution for the co-packaged device and power supply.

- Spencer Chin

EE Times

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