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TSMC to use 193nm immersion lithography for 12-inch wafers

Posted: 22 Sep 2004 ?? ?Print Version ?Bookmark and Share

Keywords:12-inch wafers? 193nm?

Taiwan Semiconductor Mfg Corp. (TSMC) will begin producing 12-inch wafers using 193nm immersion lithography by October after adopting the process to its Fab 12. According to Burn Lin, Senior Director of the company's micropatterning technology division, "193nm technologies will hit its physical limit soon, while 157nm tools are very costly."

However, the 193nm immersion lithography lowers wavelengths down to 141nm. Lin believes that it will be the trend for makers if it can be produced commercially. There are already 10 companies that ordered 193nm immersion scanners since the middle year of this year.





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