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Dow Corning, INVINT partner in interconnect processes

Posted: 04 Oct 2004 ?? ?Print Version ?Bookmark and Share

Keywords:dow corning? invint? polymer interconnect? silicon-based materials?

Dow Corning Corp. has signed a joint development contract with INVINT Ltd, a conductive polymer interconnect technology specialist. Under the contract, INVINT will develop and characterize novel interconnect processes based on new Dow Corning conductive polymer products, including both organic- and silicon-based materials.

Conductive polymer materials are increasingly being used in a wide range of interconnect applications, from cell phones and smart cards to military and automotive electronics. The conductive polymer market is expected to see significant growth over the next few years, with demand in the U.S. alone increasing 5.9 percent annually to become a $4.5 billion market in 2008, according to market researcher The Freedonia Group.

"When developing new products, we're also looking at the integration and process challenges customers will face when adopting a new material," said Tom Cook, global industry executive director, Dow Corning.

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