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NEC reorganizes semiconductor assembly, testing operations

Posted: 07 Oct 2004 ?? ?Print Version ?Bookmark and Share

Keywords:nec electronics? nec semicon package solutions? system in package? sip? flip-chip ball grid array?

NEC Electronics Corp. has launched NEC Semicon Package Solutions Ltd, a back-end production company specializing in assembly and testing. Headquartered in Yanagawa City, Fukuoka Prefecture, with about 1,540 employees, the new company will offer services such as system in package (SiP) and high-pin-count packages, including flip-chip ball grid array (FCBGA).

NEC Semicon Package Solutions was formed as a result of integrating back-end operations at NEC Yamaguchi and NEC Semiconductors Kyushu. The assembly and testing operations at NEC Yamaguchi were separated and transferred to NEC Semiconductors Kyushu, and the integrated business was reborn as NEC Semicon Package Solutions. NEC Yamaguchi is expected to intensify its focus on front-end (fabrication) operations.





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