Winbond unveils new image signal processor chip

Winbond Electronics Corp. has recently announced its new image signal processor (ISP) LSI for 1.3- to 3-megapixel camera modules applied to mobile handsets. Samples of the developed product will be out this month and volume production will begin by the first quarter of 2005.

The new product, W99712, features a 1.3- to 2.1Mpixels camera module for mobile phones, providing higher picture quality and lower power consumption. The model is also capable of high level image signal processing for easier auto-focusing control, optical zooming and mechanical shutter driving.