Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
?
EE Times-Asia > Processors/DSPs
?
?
Processors/DSPs??

Winbond unveils new image signal processor chip

Posted: 13 Oct 2004 ?? ?Print Version ?Bookmark and Share

Keywords:winbond electronics? image signal processor? lsi? 1.3- to 3-megapixel? camera modules?

Winbond Electronics Corp. has recently announced its new image signal processor (ISP) LSI for 1.3- to 3-megapixel camera modules applied to mobile handsets. Samples of the developed product will be out this month and volume production will begin by the first quarter of 2005.

The new product, W99712, features a 1.3- to 2.1Mpixels camera module for mobile phones, providing higher picture quality and lower power consumption. The model is also capable of high level image signal processing for easier auto-focusing control, optical zooming and mechanical shutter driving.





Article Comments - Winbond unveils new image signal pro...
Comments:??
*? You can enter [0] more charecters.
*Verify code:
?
?
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

?
?
Back to Top