Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > T&M

Teradyne supports STATS chip testing needs

Posted: 21 Oct 2004 ?? ?Print Version ?Bookmark and Share

Keywords:teradyne? stats chippac? flex? test system? soc?

Teradyne Inc. revealed that STATS ChipPAC Ltd has selected its FLEX test system as a key platform for testing a wide range of devices for applications including communications, broadband and other consumer electronics.

FLEX with microwave capability is already installed at STATS test services facilities in San Diego and Milpitas, California, as well as the company's high volume production facilities in Malaysia and Singapore.

Mark Kelley, general manager, STATS, said, "Our focus is to provide customers with leading-edge test platforms and the support needed early in the product development cycle. Access to the FLEX in our San Diego and Milpitas test development facilities will help customers achieve their cost objectives and faster time-to-market. Customers are already signing up to use the FLEX for a wide range of requirements from conventional DFT and structural test to standard analog and complex mixed signal SOCs."

Article Comments - Teradyne supports STATS chip testing...
*? You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top