New packaging technology solves design challenges in EHPS, EPS

International Rectifier (IR) introduced a new power packaging technology to solve design challenges found in electro-hydraulic power steering (EHPS), electric power steering (EPS) and automotive motion control applications.

"IR's die-on-leadframe (DOL) packaging sets new standards in thermal and electrical performance while reducing size and weight, delivering a viable path to automakers looking to migrate to more sophisticated systems like the transition from hydraulic steering systems to EHPS and full electric systems," shared Ivo Jurek, VP for IR's Automotive Products.

The new patent-pending DOL concept in power inverter packaging delivers the lowest package inductance and resistance by minimizing the number of material layers to improve thermal performance while reducing the number of interconnections, the press release said. Lower thermal resistance allows the use of smaller silicon devices, and the lower inverter electrical resistance allows for higher current capabilities with smaller die sizes and lower torque ripple.

For medium to high power applications, IR explained, DOL packaging offers better electrical conductivity and increased thermal performance than alternative packaging methods using insulated metal substrate (IMS), direct-bonded copper (DBC) to a ceramic substrate, thick film substrates or PCB-based modules, which primarily utilize discrete power devices.

A DOL power module includes silicon devices directly soldered to a copper leadframe within an injection-molded shell. The internal components are connected directly to outside terminals, eliminating intermediate insulation and conductive layers.

The first IR devices to use the DOL technology are the automotive power modules for EPS and EHPS applications. The IR11867-E02 is a 120A module while the IR11867-E01 is a 160A module. The current ratings are continuous capability at maximum junction temperature of 175°C, and include built-in temperature-sense feedback and bus-current sensing.

Other features include high frequency, low inductance package for electromagnetic compatibility (EMC) and an integrated de-coupling capacitor across negative and positive bus for EMI suppression at high frequencies. The DOL modules are housed in a compact plastic package, measuring 60-by-36-by-8mm.