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Winbond introduces new solutions at IDF

Posted: 01 Nov 2004 ?? ?Print Version ?Bookmark and Share

Keywords:intel development forum? winbond electronics? i/o 83627ehf? amd smart fan 3? w83792d?

During the Intel Development Forum (IDF) in Taiwan, Winbond Electronics Corp. announced its new generation I/O 83627EHF, which can adapt to all platforms consisting of Intel and AMD, as well as other platforms.

According to the company, the new I/O provides not only legacy I/O functions but also several new features, such as over-temperature and over-voltage protection for CPUs, to avoid the danger of CPUs burning out. By improving the functions of hardware monitor, all of the company's new generation I/Os implement DC Fan control and SMART FAN 3 for users to easily control fan speed, simultaneously extending the fan's life time and reducing the fan's noise when the PC is working. Additionally, the W83627EHF supports VRD 10.0 and Prescott CPU fan specification.

Winbond also launched its new LPC interface KBC (Keyboard Controller/Embedded controller) named W83L951D for mobile system applications. This new device is based on turbo 8052 micro-processor core, with speeds up to 24MHz, and features 256 bytes RAM, 2KB SDAM and internal 64KB embedded flash. The W83L951D provides SMBus, PS/2 interface, pulse width modulation (PWM), digital-to-analog converters and analog-to-digital converters.

In addition, the company also released a new hardware monitoring IC aimed at server and high-end computer application. The W83792D chip supports dual CPU VID monitoring with high accuracy, and meets the latest specifications such as VRM9.X/VRD10.0, ASF2.0 and ARP2.0. Its SMART FAN II feature can provide the best fan operation and reliability, Winbond added.

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