Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > EDA/IP

TDK unveils three smart card interface circuits

Posted: 05 Nov 2004 ?? ?Print Version ?Bookmark and Share

During the smart card industry trade exhibition, Cartes 2004, TDK Semiconductor Corp. debuted its 73S8023C, 73S8024C and 73S8010C smart card interface circuits that possess an efficiency of 85 percent and a small size step-up/step-down converter that provides what the company claims as the highest card current capability for such card interfaces, with up to 100mA supplied to the card.

Additionally, a power down mode is implemented that allows the host to place the smart card interface function in a mode that will only draw a couple of micro-Amps. "The new TDK 73S80xxC new family of card interface ICs is dedicated to low-voltage, low-power, and battery-operated applications," shared TDK senior product line manager Jean-Christophe Doucet.

"With a built-in step-up/step-down converter that shows the top-of-its class performance in terms of efficiency, power consumption and card current capability, these TDK circuits are ideal for integration of card reader slots in cellphones, PDAs and personal video recorders, and of course in traditional applications like Point-of-Sales terminals, PIN-pad readers and payphones," Doucet added.

The 73S80xxC devices all comply with ISO-7816-3 and EMV4.1 standards. Differences between these three new circuits reside in the host interface. The 73S8010C is controllable through I?C, whereas the 73S8024C and 73S8023C devices exhibit parallel I/Os compatible with the industry standards TDA8004 and TDA8002. Control of multiple smart card interfaces in parallel through the same host control bus is possible without additional external circuitry with the 73S8010C and 73S8023C.

The 73S8024C is firmware compatible with current industry-standard devices. Consumer applications such as STBs, DVD/HDD recorders and LCD TVs can take advantage of the low-voltage operating mode of the 73S8024C to remove the 5V system power supply from their conditional access functions, lowering the overall BoM costs. Significant reduction of power dissipation is possible with the TDK 73S80xxC, which displays more than 500mW of savings compared measured under EMV conditions, the company added.

Samples of 73S8024C, 73S8023C and 73S8010C are already available. These ICs are housed in SO28 and in QNF32 packages, making them suitable for applications that need to save board space. Like all other TDK products, these new circuits are also available in lead-free and green materials. Production volumes will be available in Q1 2005. Pricing starts at $2 each in 1,000-unit quantities. Demo boards are also available.

Article Comments - TDK unveils three smart card interfa...
*? You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top