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Microchip offers lead-free product packaging

Posted: 11 Nov 2004 ?? ?Print Version ?Bookmark and Share

Microchip Technology Inc., a provider of microcontroller and analog semiconductors, disclosed the conversion of its product packaging to environmentally friendly lead (Pb)-free plating, beginning January 2005. The announcement is in compliance with pending global government regulations and industry standards.

The company says it has selected matte tin (Sn) as its new plating material. This ensures that Microchip Pb-free products are backward compatible with industry-standard, tin/lead-based soldering processes, and forward compatible with higher-temperature Pb-free processes that are used with Pb-free pastes such as tin/silver/copper (SnAgCu).

The European Union "Restrictions on Hazardous Substances" (RoHS) directive is scheduled to go into effect on July 1, 2006, and governs all electronic equipment manufactured or sold in the European Union member countries. This directive limits the amount of Pb in electronic equipment. By enabling customers to convert to Pb-free semiconductors early, Microchip is helping them to eliminate Pb from their manufacturing processes well ahead of schedule. Microchip expects to phase out its inventory of tin/lead (SnPb)-plated products far in advance of the 2006 deadline.





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