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TI, Commit enable next-gen chips for China's 3G market

Posted: 19 Nov 2004 ?? ?Print Version ?Bookmark and Share

Keywords:texas instruments? commit? 3g wireless? td-scdma chipset? omap multimedia processors?

Texas Instruments Inc. and Commit Inc. are driving 3G wireless innovation in Asia, providing the Chinese wireless industry with a flexible TD-SCDMA chipset solution easily customized for supporting complex 3G applications. The TI and Commit solution incorporates TI's OMAP multimedia processors and dsp technology.

Working together to drive 3G growth in China, the companies' chipset provides an alternative chipset solution to the Chinese wireless industry, which until recently has been dependent on imported technology. Locally designed to support TD-SCDMA, the home grown 3G standard for China, the Commit and TI chipset solution enables handset manufacturers to shorten their time to market, thus speeding up the industrialization process of the 3G TD-SCDMA industry.

Commit recently announced its complete chipset solution and architecture for TD-SCDMA terminals integrating TI technology, including the RF, analog baseband and digital baseband chip, TI's OMAP processor, and its protocol stack software, which support the TD-SCDMA voice and data requirement. The complete chipset solution will be ready for mass production in 2005.

"3G is picking up steam around the globe, and China is no exception," said Gerald Kuo, TI China managing director. "TI's wireless systems know-how drives significant value for TI customers in the form of hardware and software solutions designed specifically for the wireless environment, including 3G. Through the cooperation between Commit and TI, Commit is able to provide a complete TD-SCDMA terminal solution compliant with 3GPP standards. This will be a driving force to promote TD-SCDMA in the worldwide 3G market."

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