Ceva DSP powers China's 3G mobile phone chipset

Ceva Inc. and Spreadtrum Communications disclosed that Spreadtrum has developed a 3G TD-SCDMA Chinese standard mobile phone chipset powered by the Ceva-Teak DSP core.

Spreadtrum's multi-band chipset SC8800 is claimed to a complete wireless chipset for GSM/GRPS/TD-SCDMA standards. Powered by Ceva-Teak DSP, the chipset enables dual-mode 2G/3G phones to operate transparently over China's TD-SCDMA and GSM networks.

For the chipset, Spreadtrum has signed agreements with several Chinese handset makers such as Amoi Electronics Co., Ningbo Bird Co., Lenovo Group Ltd. and Hisense Electric Co. to develop next -generation TD-SCDMA phones. China's 3G standard is due to go live in June 2005.

"We successfully rolled out the TD-SCDMA baseband chipset in less than one and a half years," said Ping Wu, Spreadtrum president, CEO.