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TI Bluetooth solution uses 90nm technology

Posted: 24 Nov 2004 ?? ?Print Version ?Bookmark and Share

Keywords:texas instruments? ti? bluetooth? wireless networking solution? 90nm?

Texas Instruments Inc. released what is touted to be the industry's first single-chip Bluetooth wireless networking solution using advanced 90nm process technology.

According to TI, they were able to deliver the industry's best Bluetooth performance, lowest power and lowest cost for 2G, 2.5G and 3G mobile phone manufacturers in a single chip through the use of its 90nm process and Digital RF Processor (drp) technology.

"Bluetooth wireless connectivity continues to see significant growth opportunities, especially within the mobile phone market," said Marc Cetto, GM of TI's Mobile Connectivity Solutions business unit. "Recognizing this, TI has developed the brf6300, the wireless industry's first Bluetooth single-chip in 90nm."

The BRF6300 supports the new Bluetooth specification v2.0 and enhanced data rate (EDR). TI delivers full EDR to deliver speeds up to 3Mbps in a Bluetooth network which is up to three times faster than previously possible, the press release said. The new chip also offers scalability for manufacturers since it will be software upgradeable to future Bluetooth enhancements.

The technologies used

The DRP technology and 90nm process enable the BRF6300 to integrate more unto a single-chip with lower system costs and power. The BRF6300 provides a 30 percent die size reduction over current solutions, reducing the chip's cost. Through its advance process technology, TI said, it was able to deliver maximum battery efficiency and to provide the lowest cost solution through a reduced BoM, and through integration of all but six external components for the complete Bluetooth system unto the single chip.

The BRF6300 consumes 100?A during critical in-use Bluetooth scenarios such as page and inquiry scan, which is three times lower than current solutions. The single chip also offers power reduction during voice connection. Additionally, the BRF6300 supports a shared antenna architecture and coexistence mechanism when used with the company's mobile WLAN chipsets. According to TI, this level of coexistence enables the delivery data as well as Bluetooth voice and Voice over IP over WLAN in co-located environments like mobile phones.

The BRF6300 is designed to work with TI's OMAP processors and wireless terminal chipsets. It is also integrated into several complete reference designs with TI's OMAP processors and GSM/GPRS/WCDMA TCS cellular chipsets. The device is expected to sample in Q2 2005 with full production expected in Q4 2005.

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