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NEC, NEC Electronics to develop system LSIs for 3G mobile terminals

Posted: 25 Nov 2004 ?? ?Print Version ?Bookmark and Share

Keywords:nec? nec electronics? lsi? 3g mobile terminals? gsm?

NEC Corp. and NEC Electronics Corp. have entered into a close collaboration to jointly develop a system LSI for 3G mobile terminals, in line with NEC's strategy to strengthen the competitiveness of its 3G mobile terminal platforms for the global market. Specifically, the companies will develop a dual-mode (w-cdma and GSM/gprs/edge) 3G baseband LSI, which will be the core of 3G mobile terminals.

NEC's mobile terminals business unit will be responsible for defining basic LSI specifications and verifying the LSI to be embedded in the mobile terminals. NEC Electronics will be responsible for the LSI design, development and production. The first mobile terminal which employs the LSI will be introduced to the market between October 2006 and March 2007.

Through this collaboration, NEC Electronics aims to extend its expertise to dual-mode 3G platforms for the global market. NEC has been involved in 3G R&D for a long time, accumulating 3G technologies and know-how, realizing the W-CDMA mobile handset, and contributing to 3G standardization activities.

In addition, NEC is also strengthening its development effort in Linux platform for mobile terminals, enabling effective and horizontal utilization of software development resources inside and outside company, helping to decrease development time, and supporting new mobile applications and services. NEC's Linux platform for mobile terminals will employ the jointly developed baseband LSI. With the effective combination with NEC Electronics' MP211 application processor, advanced and high performance mobile terminals applications such as terrestrial digital TV combination, various multimedia applications and voice recognition can be realized. Both companies will also strive to realize smaller, more compact mobile terminals by decreasing the size of the LSI and by creating an architecture to enable combination of the baseband LSI and application processor into a single chip.

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