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Interconnect system provides high density for high-speed signals

Posted: 06 Dec 2004 ?? ?Print Version ?Bookmark and Share

Keywords:w. l. gore? interconnect? gore ultra high density interconnect system? uhd interconnect system? test head?

W. L. Gore & Associates Inc., a provider of interconnects for automated test equipment, introduced a cable-to-board and cable-to-cable coaxial interconnect system that provides high density, cost-effective performance for high-speed signals.

According to the press release, the new Ultra High Density (UHD) Interconnect System is an ideal interconnect for test heads and probe cards used in automated test equipment, front-of-system connections and backplanes in high data rate applications, as well as bench-top testing.

Supporting data rates of up to 10Gbps, the interconnect system consists of PC board-mounted interposers/headers and low loss coaxial assemblies that can be ganged together in multi-position housings for high packaging densities (0.120-inch signal-to-signal spacing).

Lower insertion force makes this interconnect system easier to use as compared to other RF connector systems, said Gore. It provides simple, reliable, blind mating for test applications, and its small, flexible cable is easy to route, it added. In addition, the system provides RF-like performance with higher signal density compared to traditional RF connectors. The standard UHD interconnect system is available as UHD-to-UHD or UHD to a variety of standard coaxial connectors. Cable assemblies are available as single lines or ganged into housings (1 2, 1 4 and 1 8), which accommodate the UHD connectors. Typical insertion loss is 0.90dB per foot or less through 6GHz with low loss cable, and 0.75dB per foot or less through 6GHz with ultra-low loss cable.

The UHD-compatible PCB header is available in both surface and edge-launch versions. Each consists of multiple UHD contacts ganged together in a header (1 2, 1 4 or 1 8), and headers can be stacked side-to-side or end-to-end.

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