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Winbond achieves silicon success with Synopsys design platform

Posted: 17 Dec 2004 ?? ?Print Version ?Bookmark and Share

Keywords:winbond? synopsys? galaxy design? 130nm? mpeg-4 multimedia chips?

Winbond Corp. has achieved first-pass silicon success using Synopsys Inc.'s Galaxy Design platform for its latest 130nm, MPEG-4 multimedia chips. The Galaxy platform includes a correlated solution for prevention, repair and sign-off that, along with TSMC in-house libraries for noise analysis, helps customers such as Winbond to achieve fast, accurate signal integrity (SI) closure.

Winbond's MPEG-4 chip is representative of 130nm designs, where utilization of greater than 80 percent of the silicon area is fast becoming the norm. Congestion and increased risk of SI issues are more prevalent in chips of this density, and can contribute to increases in chip failure, declines in yield at target frequencies, and reduced performance.

Anchored by Synopsys' Design Compiler, Physical Compiler, Astro, PrimeTime and Star-RCXT products, the Galaxy platform delivers a correlated solution for prevention of the majority of SI issues caused by crosstalk, noise, voltage drop and electromigration. Addressing the remaining few noise violations post-route is aided by the Galaxy platform's automatic repair flow.

"At Winbond, we recognize signal integrity can be a device-and-yield- killer at 130nm design and below," said Shang-E Tai, assistant VP, Winbond. "Using Synopsys Galaxy platform, we signed off our MPEG-4 designs. In full production, we are expecting it to help us attain maximum yield at our target device frequency," Shang-E Tai added.





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