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TSMC verifies 90nm chips using immersion lithography tools

Posted: 29 Dec 2004 ?? ?Print Version ?Bookmark and Share

Keywords:immersion lithography tools? 90nm?

Taiwan Semiconductor Mfg Co. (TSMC) said that it used immersion lithography tools to produce fully functional 90nm devices. The company's circuits represent the first data that immersion-based lithography systems are nearing production-ready status.

Yield, device characteristics and defect levels were comparable for both dry and wet scanners. The yield-related depth of focus of the immersion scanner is almost twice that of the dry scanner.

"While some optimization may still be in order, we have promising results pointing to immersion lithography systems and tools capable of producing functional deep-submicron devices that will scale well below the 90nm node," said Dr. Lin. "The larger focal range is the most significant finding, because it suggests that immersion tools can safely image with better yield than previously anticipated. This finding can be extrapolated to infer even greater benefits at the 65nm node."

TSMC estimates that immersion lithography tools may be called upon for 65nm production and are the chosen candidates for 45nm production. The company began installing its first 65nm immersion lithography system in early November this year.





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