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Hitachi Chemical obtains patent for IC mount assembly tape

Posted: 04 Jan 2005 ?? ?Print Version ?Bookmark and Share

Keywords:ic packaging mount? quad flat non-leaded package? quad flat package?

Hitachi Chemical Co. Ltd has acquired a basic patent for assembly tape used for its quad flat non-leaded package (QFN) method, a type of IC packaging mount. The QFN method was able to achieve a substantial decrease in the mounting area by storing external input/output leads on the rear of the package, instead of placing them outside as in the previous quad flat package (QFP) methods. The method is expected to become the new system for the miniaturization of electronic devices, especially cell phones.

The company's newly developed tape is specifically designed for QFN assembly. The tape, which features heat resistance and leaves lower level of residue after removal, should be a key material in integrate molding during assembly processes. According to Hitachi Chemical, its technologies accumulated from long experience in heat-resistant adhesive tapes achieved an optimization of adhesiveness for this tape, which enables a considerably lower level of residue after removal of the tape, while preventing leakage of encapsulant resin during molding. The improved thickness and physical properties of the new tape also resist warping of the lead frame after application, contributing to a substantial increase in productivity during package manufacturing.

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