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Teradyne advances PCB capabilities

Posted: 19 Jan 2005 ?? ?Print Version ?Bookmark and Share

Keywords:pcb? electrolytic ni-au?

Teradyne Inc.'s connection systems division announced the formation of a PCB technology team that is expected to develop and introduce new products and processes. The team is comprised of veteran PCB engineers who will be committed full-time to the project.

In line with the announcement, a laser direct imaging system will be installed this month and an automated nomenclature machine, while an implementation of electrolytic Ni-Au, capable of 54-inch panels, is also underway.

"At Teradyne, our strategy is to focus on differentiated, technology where we have always had a competitive advantage," said Tom Pursch, VP Teradyne connection systems. "This dedicated technology team will help us to lengthen that lead. At the same time, the business will focus aggressively on reducing our costs and partnering with overseas PCB manufacturers to provide the best possible value to our customers," Pursch added.

Teradyne's connection systems division's printed circuit technology and fabrication capabilities include: a wide variety of materials to enable increasing signal speeds, deep microvias, buried, blind and backdrilled vias, sequential lamination, panel sizes from 16-inch-by-18-inch up to 24-inch-by-54-inch, layer counts to 60+ and board thicknesses up to .500-inch. Teradyne's printed circuit fabrication facility is MIL-PRF-31032/1A, /2, MIL-P-55110 and ITAR certified.





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