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Soitec supplies AMD with UNIBOND SOI wafers

Posted: 19 Jan 2005 ?? ?Print Version ?Bookmark and Share

Keywords:unibond? silicon-on-insulator? wafer? amd?

Soitec Group has inked an agreement with AMD for a long-term supply of UNIBOND silicon-on-insulator (SOI) wafers. Under the terms of the multiyear agreement, projected to total more than $50 million for 2005 alone, Soitec will supply AMD with both 200mm and 300mm SOI wafers, manufactured using Soitec's proprietary Smart Cut process.

Soitec has been supplying AMD with volume quantities of thin-film UNIBOND SOI substrate solutions for the production of their most advanced microprocessors.

"This order also further validates our decision to invest in 300mm manufacturing during the last industry downturn, as it has strategically positioned Soitec to deliver the on-demand capacity needed to support our growing customer needs," said Andre Auberton-Herve, president, CEO of Soitec Group.

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