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ST unveils 32Mb flash memory chip for automotive apps

Posted: 01 Feb 2005 ?? ?Print Version ?Bookmark and Share

Keywords:stmicroelectronics? st? flash memory chip? m58bw032?

A new 32Mb flash memory chip designed specifically for demanding automotive applications was announced by STMicroelectronics.

Maintaining high-speed access over a wide operating temperature range, the M58BW032 is well suited for use in powertrain and transmission control modules, ABS controllers, and in other high- performance automotive systems.

According to the press release, the new chip uses a state-of-the-art architecture to reduce access times to as low as 45ns over the full automotive temperature range (-40C to 125C packaged, -40C to 150C bare die), enabling it to be used for code execution as well as for storage.

The M58BW032 features a wide 32bit data bus and maintains the high data throughput pioneered by the previous generation M58BW016 device. Compatibility with the M58BW016 is preserved including its pin-to-pin footprint, software configuration protocols, and power consumption performance. Additionally, the device matches the new generation of 75MHz 32bit microcontrollers, which are supported by a burst reading protocol enabled by high-speed logic and the advanced 0.13?m technology.

Key features include a 3.3V core supply, a flexible input/output interface operating from 1.6V to 3.6V, and separate 1.6V power supplies for input and output buffers. The single bank memory is organized as eight parameter blocks of 64Kb, three blocks of 128Kb, one OTP (One Time Programmable) block of 128Kb, and 62 main blocks of 512Kb each. It operates in x4, x8 double, long word, or continuous burst modes, with configuration controlled through a dedicated register; access times of 45ns, 55ns and 60ns are available. Maximum burst frequency is 75MHz over the full automotive temperature range, and flexible protection techniques include WP# pin, 64bit password tuning protection and a protection register.

Manufactured using an advanced 0.13?m technology, the M58BW032 is supplied in LBGA80 and PQFP80 packages, and in Certified Bare Die form. And for security, each die embeds a unique device ID to allow the use of cryptographic algorithms for protection against illegal software modifications.

Priced at $6 each, engineering samples of the M58BW032 are already available for evaluation, with volume production expected in Q3 2005.

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