Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
?
EE Times-Asia > RF/Microwave
?
?
RF/Microwave??

Toshiba adopts SonicsMX handheld chips

Posted: 07 Feb 2005 ?? ?Print Version ?Bookmark and Share

Keywords:sonicsmx? sonics3220 smart interconnects? wireless handheld?

Toshiba Corp. will design the SonicsMX and Sonics3220 SMART interconnects into its family of wireless handheld products. Toshiba currently uses Sonics' Silicon Backplane(TM) SMART interconnect and Sonics' MemMax memory scheduler in its processor-based digital consumer products.

SonicsMX offers SoC developers the flexibility to build custom or "hybrid" crossbar shared-link topologies in a configurable manner, so SoC developers can marry latency dependent data communications and throughput dependent digital multimedia streaming on the same chip. Other advanced SonicsMX features, such as power management, security, and quality of service management, further ease the burden of interconnect development and are only found in SonicsMX. Common tightly-coupled bus architectures don't support hybrid topologies, or similar advanced features contained in SoncisMX, resulting in a higher design burden on the SoC developer.

The announcement marks Toshiba's endorsement of the entire Sonics product offering for deployment into its SoCs for wireless and digital consumer applications.





Article Comments - Toshiba adopts SonicsMX handheld chi...
Comments:??
*? You can enter [0] more charecters.
*Verify code:
?
?
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

?
?
Back to Top