Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > RF/Microwave

TTPCom, NEC Electronics to team on dual-mode 3G/2G chips

Posted: 14 Feb 2005 ?? ?Print Version ?Bookmark and Share

Keywords:edge/gprs/gsm? ttpcom? silicon? software? network?

TTP Communications plc and NEC Electronics Corp. announced Thursday (Feb. 10) they would join forces to develop dual-mode chips that will include TTPCom EDGE/GPRS/GSM silicon and software architecture.

NEC Electronics has been developing a dual-mode 3G/2G chipset to address the growing demand for wireless products that can hand over to EDGE/GPRS/GSM networks outside pockets of 3G coverage.

By leveraging the wireless communications IP of TTPCom, NEC expects to speed time-to-market for its chipset. TTPCom's GPRS platform is used in wireless products globally.

"TTPCom's GSM/GPRS technology has become an industry standard, and the company is one of only a few companies to offer an effective EDGE solution today," said Masakazu Yamashina, general manager of the Mobile Systems Division for NEC Electronics, in a statement. "We were impressed with how easily we were able to integrate TTCom's solutions with our own to develop dual-mode 3G/2G baseband LSIs."

- Spencer Chin

EE Times

Article Comments - TTPCom, NEC Electronics to team on d...
*? You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top